  
 Also See
 Phase Change
 Thermal Management
 Thermal Materials |  |
Description
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In 1995, Brady Balkhausen developed a proprietary process that bonds heat sinks to printed wire assemblies and circuit boards with a pressure sensitive adhesive. The process minimizes thermal resistance and maximizes bond strength, successfully passing rigorous high temperature, low temperature, and thermal cycling tests.
Our heat sink bonding solutions work with multi-layer FR4 and ceramic hybrid boards, ensuring diverse application. With over 10 million units in the field and on the road, Balkhausen's unique process is the definitive pressure sensitive bonding solution for your heat sink applications.
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Features and Benefits
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Increased Yields
Vision systems achieve placement tolerances as good as +/- 0.15mm for PSA's, customer's population and testing process yields increase due to reductions in failures due to incorrect PSA lamination and PWA bonding.
Greater Design Flexibility
The Brady Balkhausen process allows for bonding and lamination of printed wire assemblies that are already populated on one side, allowing you to utilize double sided boards.
High Throughput
No oven backing or batch processing required. With cycle times less than 1 minute, annual production volumes of 1MM+ are achieved.
Work with Existing Heat Sink and PCB Suppliers
Unlike Insulated Metal Substrate (IMS) technologies, the Brady Balkhausen process does not require complex manufacturing processes to handle your PCBs and heat sinks. We can work with your existing heat sink and PCB suppliers or assist in developing new suppliers.
Applications
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 Engine Control Modules
 High Vibration Automobiles
 Ceramic Hybrid Boards
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