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Thermal Managment > Thermal Adhesives
Thermally conductive pressure sensitive adhesives offer excellent thermal conductivity with no need for oven curing. Both electrically insulating and electrically conductive adhesives are available. See the table below for more details and click on the product names for a PDF datasheet.
Product | Thickness (inches) | Dielectric Strength (V) | Thermal Resistance
(C in2/W) | Application Ideas |
| T2022-50 | .002 | 1000 | 0.15 | Applications requiring thin bonding with good thermal transfer; CPU; flex circuit and power transformer bonding to heat sinks and other cooling devices. |
| T2022-75 | .003 | 1500 | 0.23 |
| T2022-100 | .004 | 2000 | 0.30 |
| TAP 003 | .003 | 6700 | <0.30 |
| TAP 005 | .005 | 6000 | 0.40 |
| TAP 105 | .005 | 7000 | 0.60 |
| T2-2022E | .005 | N/A (electrically conductive) | 0.40 | Heat sink attachment; EMI/RFI shields |
| T3033-50 | .002 | 1000 | 0.15 | Thermally conductive electrically insulating pressure sensitive adhesive designed for use where high temperature performance is required. |
| T3033-75 | .003 | 1500 | 0.23 |
| T3033-100 | .004 | 2000 | 0.30 |
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